Nanotechnology : San Jose

SPIE Photonics West 2008

Sat, 15 Sep 2007 22:43:43 +0000

Short description

Photonics West includes the entire spectrum of light-driven technologies and attracts researchers and product developers from around the world.

Long description

Photonics West includes the entire spectrum of light-driven technologies and attracts researchers and product developers from around the world. Four renowned symposia, 3,000 R&D presentations, and two robust exhibitions connect the brightest minds with leaders in science and technology.
+ BIOS 2008
+ LASE 2008
+ MOEMS-MEMS 2008
+ OPTO 2008
Register for the opportunity to:
+ Collaborate with colleagues across diverse fields and disciplines
+ Add value to your own research efforts
+ Get up to date on the latest developments in your field

Event precise location and contact information

Web site Url link

http://spie.org/photonics-west.xml?WT.mc_id=RCALENDARW

Web site Url text

http://spie.org/photonics-west.xml?WT.mc_id=RCALENDARW

Novellus Systems, Inc.

Benj — Thu, 15 Mar 2007 11:22:33 +0000

Ticker Id

Web url

http://www.novellus.com/

Contact Email

info@novellus.com

Short description

Street address

4000 North First Street

Zip or postal code

95134

Telephone

(408) 943-9700

Fax

Foundation date

Ceo, president

Number of employees

Long description

The company’s legacy CVD, PVD, and ECD products are used to deposit extremely thin films of insulating and conductive materials that are used to create the wiring on a chip. Other Novellus products are used to clean the surface of the chip in-between manufacturing steps (surface preparation), to polish the surface of the device to ensure a flat (planar) surface (CMP), or to post-treat deposited films in order to improve mechanical properties (UVTP). As circuit geometries decrease in size, the deposition, surface preparation, CMP, and film treatment systems manufactured by Novellus become increasingly critical technologies for manufacturing advanced semiconductor devices.

Additional Commentaries and remarks

Patents

Nisvara, Inc.

Benj — Wed, 16 Aug 2006 13:46:05 +0000

Ticker Id

Web url

http://www.silentcomputing.com/

Contact Email

Short description

Street address

2 North First St. 4th Floor

Zip or postal code

95113

Telephone

Fax

Foundation date

Ceo, president

John L. Sokol

Number of employees

Long description

Nisvara has developed cooling components and system solutions applicable to electronics in all markets. Nisvara cooling solution applies to electronic components, devices, equipment and large rack mounted systems using innovative conductive cooling technology using carbon fibers, carbon nano tubes (CNT), CNT fibers and a variety of composites and matrices.
Industry and Market: Heat transfer and cooling of electronic components, devices and the system to include computers and other electronics equipment in business, consumer, industrial, medical, power and energy, aerospace and defense applications.
Products: Heat sinks, heat pipes and many other cooling components in the electronics industry with innovative high thermally conductive materials, heat pipes
Services: System level modeling and analysis, thermal design to substantially improve the cooling and energy efficiency at competitive price-performance to OEM customers in computer, telecom and other electronic industry.
Innovative Technology: very high thermal conductivity materials to include carbon fibers, carbon nano tubes (CNT), CNT fibers, composites and matrix.
Competitive Value: Small, very light, easy to manufacture, assemble and maintain. Passive solution. Reduces failure rate of all components and the system, saves power / energy, makes the equipment silent / quiet, superior thermal conductivity, replacement cost to existing solutions, makes the equipment thinner and smaller, substantially reduces EMI (electro magnetic interference), makes the equipment dirt and germ proof. Nisvara has already build few systems working for close to two years. Multitalented team of veterans with technology, industry, manufacturing, business, entrepreneurial and corporate management accomplishments.
Energy Savings for Rack Mounted Servers: Nisvara has developed novel efficient ways of cooling computers. What is described herein is an initial experiment performed by Nisvara, Inc. in measuring the total operating power and component temperature of a single proof-of-concept server as the server components are cooled. The systems improved efficiency is accomplished by utilizing a direct thermal-ground, an analog of electrical-ground developed by Nisvara.

This small-scale un-optimized proof-of-concept experiment shows an energy savings of 4.6 watts for each 1.0 watt of cooling power (by using the thermal ground principle) in comparison to current industry methods, of a waste of 2-3 watts of cooling power for each watt of computer power(1). In summary;
Nisvara ’s total system approach in this small-scale experiment results in; saving 4.6 Watts of computing power per each Watt of additional cooling energy used
Whereas, the current industrys method of blowing cool air into a room to cool equipment results in only; 0.33 watts of savings of computing power per each Watt of additional cooling energy used.
So, it appears Nisvara ’s technology approach is 14X more efficient.
In this small-scale experiment, of the total power consumed by both the server and cooling system, the cooling system uses only 13% of the total power.
Innovative Approach: Total equipment and rack level solution for cooling, compared to the component level cooling done all other companies. This is made possible by Nisvara patented Thermal Ground, Thermal Bridge and other conductive cooling. Heat from all sources are transferred to a Thermal Ground (akin to the electrical ground) by Nisvara's product suite of efficient and passive conduction devices.
Competition: Bulky component level solution with problems of additional power / energy, space and weight. No improvement in equipment level cooling. They are very expensive. Many competitors have already spent multi million dollars with the product still in development.
Compelling Strategic Alliance Opportunity: Innovative technology, large addressable market, promising business opportunity with high financial returns, formidable competitive values, seasoned executive team, no product / technology risk with product already developed.

Additional Commentaries and remarks

Patents

Komag, Inc.

Benj — Sat, 19 Aug 2006 15:10:08 +0000

Ticker Id

Web url

http://www.komag.com/

Contact Email

Short description

Street address

1710 Automation Parkway

Zip or postal code

95131

Telephone

(408) 576-2000

Fax

(408) 944-9255

Foundation date

Ceo, president

Number of employees

Long description

Komag is the world's largest independent supplier of thin-film disks, the primary high-capacity storage medium for digital data in computers and consumer appliances. Since being founded in 1983, Komag has led the industry in production volume and technology for thin-film disks. We have capitalized on our technological strength in thin-film processes and our manufacturing capabilities to achieve and maintain our position as a leading independent supplier to the thin-film media market. Our technological strength stems from the depth of our understanding of materials science and the interplay between disks, heads and other disk drive components. Our manufacturing expertise in thin-film media is evidenced by our long, uninterrupted history of delivering reliable products in high volume. By enabling rapidly improving storage density at lower cost per gigabyte, Komag creates extraordinary value for consumers of computers, enterprise storage systems, and electronic appliances.

Additional Commentaries and remarks

Patents

Nanotechnology commercial trends and forecast for success

Benj — Sun, 19 Nov 2006 18:16:08 +0000

Short description

Nanotech is evolving from discovery to commercialization, and leading corporations and startups in fields like materials and manufacturing, life sciences, electronics, and instrumentation are feeling the impact. This is driving big changes in science-centric business areas like research and product development. Nanotech’s commercial success is now even hitting more mundane functions like partnering and hiring, as the number of people working on nanotech in large corporations will increase sixfold in the next three years. The talk will describe these trends with facts from today and forecasts for tomorrow.

Long description

Speaker Biography:
Mark Bunger joined Lux Research with 14 years of business strategy experience, both as a management consultant and technology analyst. Most recently, he was a Principal Analyst at Forrester Research, where he studied and advised clients in manufacturing industries. The first years of Mark's career were spent at Accenture in the U.S., U.K., and Scandinavia, where he was a consultant focusing on a variety of industries and technologies. Mark’s work can be found on CNN, CNBC, The Wall Street Journal, and the Financial Times.
Mark's education includes International Marketing at Märdalen Polytechnic in Sweden, and Market Research at the University of Texas. In addition, Mark studied biochemistry through the University of California at Berkeley's extension program, and currently assists part-time in a neural stem cell lab in the UCSF Department of Neurology.

Event precise location and contact information

Time: Registration & light lunch 11:30am. Presentation & Q/A 12:00 to 1pm
Place: SEMI World Headquarters 3081 Zanker Rd. San Jose, CA
Cost: Members and Students $5. Non-Members $10
RSVP: dhavaljb@aol.com Web link: www.ieee.org/nano

Web site Url link

http://www.ieee.org/nano

Web site Url text

Ieee

Applied MicroStructures, Inc.

Benj — Wed, 16 Aug 2006 17:39:18 +0000

Ticker Id

Web url

http://www.appliedmst.com/

Contact Email

info@appliedmst.com

Short description

Street address

1020 Rincon Circle

Zip or postal code

95131

Telephone

Toll Free: (877) MVD-AMST, (408) 907-2885

Fax

Foundation date

Ceo, president

Number of employees

Long description

Applied MicroStructures, Inc. is a privately held technology company with a mission to enable manufacturing of microstructures by innovating unique processing solutions and equipment critical to their commercialization.

Additional Commentaries and remarks

Patents

MOEMS-MEMS 2008 – Part of SPIE Photonics West

Sat, 15 Sep 2007 22:47:07 +0000

Short description

Long description

Micro- and nanofabricated electromechanical and optical components, created by batch processing, provide the missing links to the mass-produced miniaturized products and systems of the future, superior in cost, performance, and reliability. Be a part of this evolution by presenting your research in this international premier symposium.
Each year we also commit one of our conferences to illuminate an emerging area of interest. Following up the success of last year's conference on the Micro-Nano Interface, this year's focus will be on Transducers at the Micro-Nano Interface.
Awards for Best Papers will be presented for each conference and for the overall Symposium. The most outstanding papers from each conference of the Symposium will be recommended for submission to the Journal of Micro/Nanolithography, MEMS, and MOEMS (JM3), SPIE's refereed and archival journal of progress in the science and technology of lithographic, fabrication, packaging, and integration technologies for electronics, photonics, MOEMS, and MEMS.
Our 2008 symposium will feature exciting joint sessions among our conferences and other Photonics West symposia, facilitating interaction of a larger and diversified group of attendees and participants. Our symposium will kick off, as always, with outstanding plenary speakers covering cross-cutting and synergistic topics, while our individual technical conferences will stimulate audiences on more focused topics with excellent keynote speakers, invited papers, and exciting panel discussions. Many selected short courses will complement the conference technical sessions. As a participant, you will have the opportunity to meet innovative people, undertake new initiatives, invigorate your thinking, and motivate yourself towards your goals and objectives.

Event precise location and contact information

Web site Url link

http://spie.org/moems-mems.xml?WT.mc_id=RCALENDARW

Web site Url text

http://spie.org/moems-mems.xml?WT.mc_id=RCALENDARW

Silicon Genesis Corporation ( Sigen )

Benj — Tue, 29 Aug 2006 18:15:03 +0000

Ticker Id

Web url

http://www.sigen.com/

Contact Email

Short description

Street address

61 Daggett Drive

Zip or postal code

95134

Telephone

(408) 228-5858

Fax

(408) 228-5859

Foundation date

Ceo, president

Number of employees

Long description

The vision of SiGen is to become the leading provider of cost effective manufacturing solutions for advanced material substrates of exceptional specification for the microelectronic and photonic industries through the SiGen NanoTec™ suite of process technologies.

SiGen NanoTec™ is a premier suite of licenses that enables new innovations in NanoTechnology and takes advantage of SiGen’s layer-transfer and engineered wafer technologies as well as advanced process and equipment technologies. These licenses include NanoCleave™, NanoSmooth™, NanoBond™, and NanoStrain™.

SiGen’s signature NanoCleave™ process for thin film lamination and layer transfer is the foundation of SiGen’s technology portfolio. It was originally developed for SOI wafers, but is applicable to a wide range of products from ultra-thin SOI to advanced heterostructures such as Germanium-on-Insulator and multi-layered stacked SOI wafers. NanoSmooth™ is SiGen’s proprietary, patented non-contact wafer smoothing technology. It provides a fast and economical method of smoothing wafer surfaces to less than 1-Angstrom roughness. SiGen’s patented plasma-activated bonding process, NanoBond™, enables up to 30 times greater bond strengths than conventional wet bonding techniques. This process is applicable for a wide range of bonding and layer transfer processes including SOI, MEMS and other laminated structures.

The application of the SiGen NanoTec™ technologies reads into almost every new electronic and photonic device. A recent International Technology Roadmap for Semiconductors (ITRS) names wafer bonding and layer-transfer technologies as necessary new enabling capabilities for all future integrated device technology nodes. SiGen’s technologies can help fabricate next-generation thin-SOI, ultra-thin SOI, dual-gate, tri-gate, strained-silicon, strained-SOI, NanoPhotonic and 3D/heterogeneous devices.

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Patents

cDream Corporation

Benj — Thu, 24 Aug 2006 13:24:48 +0000

Ticker Id

Web url

http://www.cdreamdisplay.com/

Contact Email

Short description

Street address

6910 Santa Teresa Blvd. 2nd Floor

Zip or postal code

95119

Telephone

(408) 826-3216

Fax

(408) 363-6954

Foundation date

Ceo, president

Number of employees

Long description

cDream Corporation (cDream) is a fabless display company, founded to develop and design the next evolution of flat panel displays (FPDs) using our proprietary carbon-nano tube technology, replacing and superceding displays based on cathode ray tube (CRTs), thin film transistor liquid crystal (TFT-LCDs), plasma display panels (PDPs) and organic light emitting diodes (OLEDs). Engendered by todays need for mobility and the convergence of entertainment, multimedia and computing needs, both businesses and personal consumers are demanding display technology, which are lightweight, compact, high in picture quality and video response and power efficient.

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Patents

SPIE Advanced Lithography 2008

Sat, 15 Sep 2007 22:52:10 +0000

Short description

Participate in the most important technical event in the semiconductor lithography industry.

Long description

The SPIE Advanced Lithography Symposium is the premier annual international forum bringing practitioners of micro- and nanolithography together in a stimulating, informative, and interactive environment. The Symposium is fully committed to support your interests whether you work in semiconductor production lines, pilot lines, or research laboratories. It succeeds because the programs are tailored to professionals developing and using cutting-edge technologies and techniques. Also, the numerous short courses offered taught by individuals who are active in the field and recognized for their theoretical knowledge and practical experience.

Event precise location and contact information

Web site Url link

http://spie.org/advanced-lithography.xml?WT.mc_id=RCALENDARW

Web site Url text

http://spie.org/advanced-lithography.xml?WT.mc_id=RCALENDARW

Ahwahnee Inc.

Benj — Wed, 16 Aug 2006 19:32:43 +0000

Ticker Id

Web url

http://www.ahwahneetech.com/

Contact Email

info@ahwahneetech.com

Short description

Street address

5941 Optical Court

Zip or postal code

95138

Telephone

408.960.3812

Fax

408.960.3817

Foundation date

Ceo, president

Number of employees

Long description

Ahwahnee Technology, a leader in the mass production of Carbon Nanotubes (CNTs), creates high-energy, long-lasting and cost-effective CNT applications for a variety of industries. The Company is uniquely focused on developing innovative technologies geared towards improving daily life while protecting the global environment.

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Patents

Nanopics

Benj — Fri, 18 Aug 2006 12:39:34 +0000

Ticker Id

Web url

http://www.ktnanopics.com/

Contact Email

Short description

Street address

160 Rio Robles

Zip or postal code

95134

Telephone

+1-408-875-3000

Fax

+1-408-875-4144

Foundation date

Ceo, president

Number of employees

Long description

KLA-Tencor Corporation is the world's leading supplier of process control and yield management solutions for the semiconductor and related microelectronics industries. The company's comprehensive portfolio of products, software, analysis, services and expertise is designed to help IC manufacturers manage yield throughout the entire wafer fabrication process-from R&D to final yield analysis. Since yield improvements are key to increasing manufacturing productivity and profitability, the yield management market that KLA-Tencor leads has outperformed the semiconductor capital equipment market segment as a whole.

Ranked among the world's top ten semiconductor equipment manufacturers, KLA-Tencor offers a broad spectrum of products and services that are used by every major semiconductor manufacturer in the world. These customers turn to KLA-Tencor for in-line wafer defect monitoring; reticle and photomask defect inspection; CD SEM metrology; wafer overlay; film and surface measurement; and overall yield and fab-wide data analysis. These advanced products, coupled with the company's unique yield management consulting practice, allow KLA-Tencor to deliver the complete yield management solutions customers need to accelerate their yield learning rates, reduce their yield excursion risks and adopt industry-leading yield management practices.

Competing in rapidly expanding markets where its leading-edge technology and comprehensive solutions provide a significant competitive edge, KLA-Tencor's primary market remains the semiconductor industry. In recent years, the company has also increased its focus on the rapidly growing data storage industry.

KLA-Tencor offers a leading edge set of solutions for process control for wafer surface metrology, including advanced surface profilers and an in-situ CMP endpoint control system.

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Patents

SVTC Technologies

Benj — Wed, 25 Jul 2007 09:39:25 +0000

Ticker Id

Web url

http://www.svtc.com/

Contact Email

Short description

Street address

3901 North First Street

Zip or postal code

95134

Telephone

408-240-7000

Fax

Foundation date

Ceo, president

Number of employees

Long description

Working in an IP-secure development foundry, SVTC customers have access to advanced process engineering experts for specialized materials, process or integration requirements, a Process Library with over 500 process recipes for over 50 tools, 8-inch processing tools that support the International Technology Roadmap for Semiconductors' (ITRS) 65nm roadmap, as well as the capability to integrate new materials and processes.

SVTC Services also include its FastXfer Commercialization Services that anticipate the challenges of transferring technology into a full-scale production environment. These services leverage the experience of SVTC process engineers to expedite time to revenue while managing rework and other associated costs. Customers may choose their own manufacturing partners or leverage SVTC's Foundry Partner relationships.

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Patents

VESTA Technology, Inc.

Benj — Thu, 12 Jul 2007 09:56:39 +0000

Ticker Id

Web url

http://www.vestatechnology.com/

Contact Email

info@vestatechnology.com

Short description

Street address

3003 N. First Street

Zip or postal code

95134

Telephone

408 - 519 - 5800

Fax

408 - 519 - 5803

Foundation date

Ceo, president

Number of employees

Long description

VESTA offers leading edge solutions for advanced thin-film deposition, ferroelectric materials and dry etch technologies utilizing Atomic Layer Deposition (ALD), Metal ALD/CVD, and Plasma Enhanced Dry Etching. As a core ALD technology company, VESTA innovates and commercializes the processing and manufacturing technologies that helps semiconductor companies produce the world's most advanced devices with competitive capabilities and manufacturing processes uniquely tailored for their needs.

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Patents

NanoNexus

Benj — Mon, 21 Aug 2006 16:35:43 +0000

Ticker Id

Web url

http://www.nanonexus.com/

Contact Email

info@nanonexus.com

Short description

Street address

2520 Junction Avenue

Zip or postal code

95134

Telephone

408-546-8400

Fax

408-546-8409

Foundation date

Ceo, president

Number of employees

Long description

NanoNexus manufactures electrical connectors for miniature devices to communicate with larger systems. We enable higher density devices and lower cost with higher performance.

IC densities continue to increase following Moores law to reduce fabrication costs by placing more parts on each wafer built. At the same time ICs have increased operating frequency to provide faster operation and data bandwidths. These two trends are key to providing the end consumer with faster, lower cost products which consume less power.
NanoNexus is a privately held, venture backed company working on developing advanced interconnect solutions. The founders worked together at large corporations and start-up companies before starting NanoNexus on January 26, 1999.

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Patents

Discera Inc.

Benj — Fri, 18 Aug 2006 17:05:37 +0000

Ticker Id

Web url

http://www.discera.com/

Contact Email

Short description

Street address

1961 Concourse Drive

Zip or postal code

95131

Telephone

408.432.8600

Fax

408.432.8609

Foundation date

Ceo, president

Number of employees

Long description

Discera technology is based on the integration of its miniaturization, semiconductor and advanced circuitry expertise. Its core miniaturization know-how is the foundation for a common design and fabrication platform that makes possible cost-effective, tight integration of RF components on a micro scale, including such devices as multi-frequency micro-oscillators and micro-filters that until now have consumed large amounts of space and power. Discera's flagship technology, micro-resonators that can be fabricated in multiples on a single die, is expected to enable complete radio IC integration both receiver and transceiver in a single module or chip. Discera supplies miniaturized stand-alone electronic components as well as complete semiconductor intellectual property solutions for the design and manufacture of highly integrated, cost-effective RFICs. Discera's initial product line consists of discrete, multi-frequency micro-oscillators (1mm per side) designed for reference frequency signals in a wide range of wireless applications including cellular, WLAN, GPS, Bluetooth and RFID devices. Disceras low-cost, low-power micro-oscillators are direct replacements for larger quartz-based oscillators currently on the market. Other office: Discera Inc. 655 Phoenix Drive Ann Arbor MI 48108 Tel: (734) 528-6366 Fax: (734) 528-6367

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Patents

Ultratech

Benj — Tue, 22 Aug 2006 12:06:22 +0000

Ticker Id

Web url

http://www.ultratech.com/

Contact Email

Short description

Street address

3050 Zanker Road

Zip or postal code

95134

Telephone

(800) 222-1213

Fax

(408) 325-6444

Foundation date

Ceo, president

Number of employees

Long description

Founded in 1979, Ultratech, Inc. (Nasdaq:UTEK) designs, manufactures and markets photolithography equipment used worldwide in the fabrication of semiconductor and nanotechnology devices. The company produces products designed to substantially reduce the cost of ownership for manufacturers in the electronics industry. Ultratech is the market leader in gold and solder bump lithography.

Additional Commentaries and remarks

Patents

Nanotech: Imagine the Possibilities! 2006

Benj — Thu, 26 Oct 2006 13:41:27 +0000

Short description

Second Annual Symposium Showcasing University Graduate Research.

Long description

Novel features of this Symposium include:
Pre-publication briefs of university graduate research topics in nanotechnology.
Challenge to the attendees to contribute imagined potential applications and opportunities that may transcend the present scope of the presented work.
Ample opportunity for networking with the graduates and other attendees.

Graduate research topics to be presented include:
Aligned carbon nanotubes filter for gas and water purification.
Nanoscale cell injection systems.
Prediction of nanocomposite properties using an AFM.
Pulsed LASER deposition of nano ferroelectric & ferromagnetic films.
Nanostructured templates for improved PV organic semiconductors.
Synthesis of Silver nanoparticles with less than 3nm diameters.
Carbon nanotube microelectrode arrays.
Tissue engineering enabled by functionalized nanotubular bacterial virus.
Micro-reservoir Arrays for Chemical Delivery.

Registration:
Please register in advance to ensure there is plenty of lunch.
Online Registration: http://www.acteva.com/booking.cfm?bevaid=120032
or
RSVP by email to dhavaljb@aol.com
IEEE Members, students, unemployed: $15
Non IEEE Members: $25
At the door registration, cash or checks only, ADD $5

Event precise location and contact information

SEMI World Headquarters, 3081 Zanker Rd. San Jose, CA

Any questions: nickmassetti@ieee.org

Web site Url link

Web site Url text

Kainos Energy Corporation

Benj — Thu, 24 Aug 2006 13:23:25 +0000

Ticker Id

Web url

http://www.kainosenergy.com/

Contact Email

info@kainosenergy.com

Short description

Street address

2911 Zanker Road

Zip or postal code

95134- 2125

Telephone

+1 408 321 5057

Fax

+1 408 321 5018

Foundation date

Ceo, president

Number of employees

Long description

Kainos Energy has adapted revolutionary nanomaterials processing technologies to fuel cell manufacturing to achieve:
lowest cost, lower operating temperature, highest performance and reliability in solid oxide fuel cells, interconnects and stacks.

The Company will revolutionize fabrication of fuel cells to realize order-of-magnitude cost reductions in solid oxide stacks while achieving improved performance and reliability to
enable large-scale market growth.

Additional Commentaries and remarks

Patents

Calient Networks, Inc.

Benj — Sun, 20 Aug 2006 20:36:52 +0000

Ticker Id

Web url

http://www.calient.net/

Contact Email

contactus@calient.net

Short description

Street address

6620 Via Del Oro

Zip or postal code

95119

Telephone

408.972.3600

Fax

408.972.3800

Foundation date

Ceo, president

Number of employees

Long description

Calient Networks is a developer of intelligent, all-photonic switching systems and software, that allows service providers to scale their networks to meet the ever-accelerating demand for bandwidth, now and for decades to come. Calients DiamondWave system will provide a foundation for rapid innovation and service delivery needed for revenue growth, while significantly reducing network operating costs by eliminating the need for opto-electronic conversion.

Headquartered in San Jose, California, Calient was founded in March 1999 by leaders in the photonic, carrier systems and networking industries. Additional company locations include engineering and manufacturing operations in Santa Barbara, California, MEMS (Micro-Electro-Mechanical-System) design and production at Calient Optical Components in Ithaca, New York, and regional sales offices worldwide. President and CEO Charles Corbalis is recognized as one of the early innovators in frame relay, and his work led to the first wide-scale network deployments of fast packet services. Mr. Corbalis has used his experience to bring together a highly credentialed team to launch the next paradigm in public network architecture and services. Each member of his leadership team has an average of 20 years of experience in carrier-class telecom and data communications product development, with numerous past successes in building and bringing to market large-scale, high bandwidth networking equipment.

Calient seeks to achieve industry leadership in all-photonic switching systems, photonic network migration, and next-generation network intelligence. The Calient switch architecture will provide a smooth migration path that is non-disruptive to existing operations, and will create the opportunity for carriers to offer new, revenue-generating optical services.