EV Group holds the dominant share of the market for wafer bonding equipment (especially SOI bonding) and is a leader in lithography for advanced packaging and nanotechnology. The companys unique Triple I approach (Invent Innovate Implement) is supported by a vertical infrastructure, allowing EV Group to respond quickly to new technology development, apply the technology to manufacturing challenges and expedite volume production. Headquartered in Austria, EV Group operates via a global customer support network, with subsidiaries in Phoenix, Arizona; Cranston, Rhode Island; Yokohama, Japan; and Chung-Li, Taiwan.